Ultrafast Picosecond Infrared Green UV Laser Cutting Machine

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Ultrafast picosecond Laser Cutting Machines are usually divided into infrared, green light and ultraviolet according to wavelength. The latter two are usually derived from infrared picosecond frequency doubling. This type of Mixed Laser Cutting Machine is characterized by a pulse width of picoseconds, and can usually use burst mode to further concentrate energy and reduce thermal effects. At present, the most commonly used functions of this type of ultrafast Cutting Machine are cutting, punching, and scribing precision glass, such as OLED, Mini LED, Micro LED and photovoltaic glass panel Scribe Machine, as well as cutting of complex shapes of wafers such as MEMS. With the large-scale mass production and technological iteration of new energy vehicles, energy storage, and new generation displays, the demand for such Laser Equipment has increased year by year.

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We have ISO9001, CE, RoHS and Other kinds of certificates, and our products are exported to more than 170 countries, such as USA, Russia, UK, France, Germany, Italy, Spain, Switzerland, India, Mexico, Brazil, Colombia, Chile, Slovenia, etc. With more than 15 years of ODM experience in Marking Machine, we provide excellent marking products and services to our customers. As the source factory of marking solutions, we provide customers with lifetime free training and continuously improve our products to ensure stable profits for our agents. Meanwhile, we are continuously seeking for agents for pneumatic Marking Machines and laser marking machines.

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