2. According to the material and thickness of the metal sheet, adjust the parameters of the Automatic
Laser Cleaner accordingly.
3. Select appropriate glasses and nozzles, and conduct pre-start inspection to check their integrity and cleaning status.
4. According to the thickness and cutting requirements of the Automatic Laser Cleaner, adjust the cutting head to the appropriate focus position.
5. Select the appropriate Automatic Laser Cleaner cutting gas and check whether its gas spraying condition is good.
6. Try to cut the material. After the material is cut, check the vertical angle of the cross section, the surface roughness and whether there are burrs and slag.
7. Analyze the cross-section situation and adjust the cutting parameters accordingly until the cross-section process of the sample meets the requirements.
8. Program the workpiece construction drawings and the design layout of the entire PCB circuit
Board cutting, and import them into the Automatic Laser Cleaner cutting system.
9. Adjust the cutting head and focus distance, prepare the auxiliary gas in advance, and cut slowly.
10. Check the production process of the sample. If there is any abnormality, adjust the basic parameters immediately until the cutting meets the production process requirements.
